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HP Intel Xeon Gold 6226R processor 2.9 GHz 22 MB Tray
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In stock
SKU
P23587-L21B
HP Intel Xeon Gold 6226R, Intel® Xeon® Gold, LGA 3647 (Socket P), 14 nm, Tray, Intel, 6226R
| SKU | P23587-L21B |
|---|---|
| Manufacturer | HP |
| In Stock | Y |
HP Intel Xeon Gold 6226R. Processor family: Intel® Xeon® Gold, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 1 TB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX, AVX 2.0, AVX-512, SSE4.2, Scalability: 2S. Compatibility: SY480 G10
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.9 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 150 W |
| Processor cache | 22 MB |
| Processor model | 6226R |
| Processor threads | 32 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.9 GHz |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 16 |
| Processor socket | LGA 3647 (Socket P) |
| Package type | Tray |
| Memory | |
| Maximum internal memory supported by processor | 1 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2933 MHz |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 150 W |
| Technical details | |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel HD Boost | No |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
| Scalability | 2S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 150 W |
| Market segment | Server |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Features | |
|---|---|
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 150 W |
| Execute Disable Bit | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
| Scalability | 2S |
| Embedded options available | Yes |
| Market segment | Server |
| PCI Express CEM revision | 3.0 |
| Processor special features | |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel Turbo Boost Max Technology 3.0 | No |
| Intel® Speed Shift Technology | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel HD Boost | No |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® Volume Management Device (VMD) | Yes |
| Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | No |
| Intel® Optane™ DC Persistent Memory Supported | Yes |
| Intel® Deep Learning Boost (Intel® DL Boost) on CPU | Yes |
| Mode-based Execute Control (MBE) | Yes |
| Intel® Run Sure Technology | Yes |
| Intel® Resource Director Technology (Intel® RDT) | Yes |
| Intel® vPro™ Platform Eligibility | Yes |
| Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | No |
| Intel® Transactional Synchronization Extensions | Yes |
| Operational conditions | |
| Tcase | 85 °C |
| Packaging data | |
| Package type | Tray |
| Other features | |
| Compatibility | SY480 G10 |
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|---|---|---|---|---|---|---|
| SKU |
P23587-L21B
|
100-000000055
|
100-000000327
|
100-000000326
|
100-000000334
|
100-000000480
|
| Manufacturer |
HP
|
AMD
|
AMD
|
AMD
|
AMD
|
AMD
|
| Processor socket |
LGA 3647 (Socket P)
|
Socket SP3
|
Socket SP3
|
Socket SP3
|
Socket SP3
|
Socket SP5
|
| Processor family |
Intel Xeon Gold
|
AMD EPYC
|
AMD EPYC
|
AMD EPYC
|
AMD EPYC
|
AMD EPYC
|
| Processor lithography |
up to 22nm
|
N/A
|
N/A
|
N/A
|
N/A
|
N/A
|
| Processor cores |
16
|
64
|
8
|
48
|
32
|
24
|
| On-board graphics card |
N
|
N
|
N/A
|
N/A
|
N/A
|
N
|
| Cooler included |
N
|
N
|
N/A
|
N/A
|
N/A
|
N/A
|
| Discrete graphics card |
N
|
N
|
N/A
|
N/A
|
N/A
|
N
|
| Package type |
Tray
|
Tray
|
Tray
|
Tray
|
Tray
|
Tray
|